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| SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Description The SMDAxxC-8 series of transient voltage suppressors are designed to protect components which are connected to data and transmission lines from voltage surges caused by ESD (electrostatic discharge), EFT (electrical fast transients), and lightning. TVS diodes are characterized by their high surge capability, low operating and clamping voltages, and fast response time. This makes them ideal for use as board level protection of sensitive semiconductor components. The SMDAxxC-8 is designed to provide transient suppression on multiple data lines and I/O ports. The low profile SO-14 design allows the user to protect up to eight data and I/O lines with one package. They are bidirectional device and may be used on lines where the normal operating voltage is above and below ground (i.e. -12V to +12V). The SMDAxxC-8 TVS diode array will meet the surge requirements of IEC 61000-4-2 (Formerly IEC 801-2), Level 4, Human Body Model for air and contact discharge. Bidirectional TVS Array for Protection of Eight Lines Features u Transient protection for data lines to IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20s) Small SO-14 surface mount package Protects eight I/O lines Working voltages: 5V, 12V, 15V and 24V Low leakage current Low operating and clamping voltages Solid-state silicon avalanche technology u u u u u u u u u u u u u u u u u u Mechanical Characteristics JEDEC SO-14 package Molding compound flammability rating: UL 94V-0 Marking : Part Number, Logo, Date Code Packaging : Tape and Reel per EIA 481 Applications RS-232 & RS-422 Data Lines Microprocessor Based Equipment LAN/WAN Equipment Set-Top Box Notebooks, Desktops, & Servers Portable Instrumentation Peripherals Serial and Parallel Ports Circuit Diagram Schematic & PIN Configuration 1 & 14 7&8 1 2 3 4 5 6 7 14 13 12 11 10 9 8 2 3 12 13 56 9 10 SO-14 (Top View) Revision 9/2000 1 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Absolute Maximum Rating R ating Peak Pulse Pow er (tp = 8/20s) Lead Soldering Temp erature Op erating Temp erature Storage Temp erature Symbo l Pp k TL TJ TSTG Value 300 260 (10 sec.) -55 to +125 -55 to +150 Units Watts C C C Electrical Characteristics SMDA05C-8 Par ame te r Reverse Stand-Off Voltage Reverse Breakdow n Voltage Reverse Leakage Current Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbo l VRWM V BR IR VC I PP Cj It = 1mA VRWM = 5V, T=25C IPP = 1A, tp = 8/20s tp = 8/20s Betw een I/O Pins and Gnd V R = 0V, f = 1MHz 6 20 9.8 17 350 Co nd itio ns Minimum Typ ical Maximum 5 Units V V A V A pF SMDA12C-8 Par ame te r Reverse Stand-Off Voltage Reverse Breakdow n Voltage Reverse Leakage Current Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbo l VRWM V BR IR VC I PP Cj It = 1mA VRWM = 12V, T=25C IPP = 1A, tp = 8/20s tp = 8/20s Betw een I/O Pins and Gnd V R = 0V, f = 1MHz 13.3 1 19 12 120 Co nd itio ns Minimum Typ ical Maximum 12 Units V V A V A pF a 2000 Semtech Corp. 2 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Electrical Characteristics (Continued) SMDA15C-8 Par ame te r Reverse Stand -Off Voltage Reverse Breakd ow n Voltage Reverse Leakage Current Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbo l V RWM V BR IR VC I PP Cj It = 1mA V RWM = 15V, T=25C IPP = 1A , tp = 8/20 s tp = 8/20 s Betw een I/O Pins and Gnd V R = 0V, f = 1MHz 16.7 1 24 10 75 Co nd itio ns Minimum Typ ical Maximum 15 Units V V A V A pF SMDA24C-8 Par ame te r Reverse Stand-Off Voltage Reverse Breakdow n Voltage Reverse Leakage Current Clamp ing Voltage Maximum Peak Pulse Current Junction Cap acitance Symbo l VRWM V BR IR VC I PP Cj It = 1mA VRWM = 24V, T=25C IPP = 1A, tp = 8/20s tp = 8/20s Betw een I/O Pins and Gnd V R = 0V, f = 1MHz 26.7 1 43 5 50 Co nd itio ns Minimum Typ ical Maximum 24 Units V V A V A pF a 2000 Semtech Corp. 3 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time 10 110 100 Peak Pulse Power - P PP (kW) 90 % of Rated Power or IPP 80 70 60 50 40 30 20 10 0.01 0.1 1 10 Pulse Duration - tp (s) 100 1000 0 0 25 50 75 100 125 150 Ambient Temperature - TA (oC) 1 Power Derating Curve 0.1 Pulse Waveform 110 100 90 80 Percent of IPP 70 60 50 40 30 20 10 0 0 5 10 15 Time (s) 20 25 30 td = IPP/2 e -t Waveform Parameters: tr = 8s td = 20s ESD Pulse Waveform (IEC 61000-4-2) Level IEC 61000-4-2 Discharge Parameters First Peak Current (A) 1 2 3 4 7.5 15 22.5 30 Peak Current at 30 ns (A) 4 8 12 16 Peak Current at 60 ns (A) 8 4 6 8 Test Test Voltage Voltage (Contact ( A ir Disch arge) Disch arge) (kV ) (kV ) 2 4 6 8 2 4 8 15 a 2000 Semtech Corp. 4 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Applications Information Device Connection for Protection of Eight Data Lines The SMDAxxC-8 is designed to protect up to 8 data or I/O lines. They are bidirectional devices and may be used on lines where the signal polarities are above and below ground. The SMDAxxC-8 TVS arrays employ a monolithic structure. Therefore, the working voltage (VRWM) and breakdown voltage (VBR) specifications apply to the differential voltage between any two data line pins. For example, the SMDA24C-8 is designed for a maximum voltage excursion of +/-12V between any two data lines. The device is connected as follows: l Circuit Diagram GND 1 I/O 1 I/O 2 N.C. 2 14 GND 13 I/O 8 I/O 7 3 12 4 11 N.C. I/O 3 I/O 4 5 10 I/O 6 I/O 5 GND 6 9 GND 7 8 Connection Diagram Pins 2, 3, 5, 6, 9, 10, 12 and 13 are connected to the lines that are to be protected. Pins 1, 7, 8, and 14 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Pins 4 and 11 are not connected. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: l l l l l l Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. a 2000 Semtech Corp. 5 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Outline Drawing - SO-14 Land Pattern - SO-14 a 2000 Semtech Corp. 6 www.semtech.com SMDA05C-8 THRU SMDA24C-8 PROTECTION PRODUCTS Ordering Information Par t Numbe r SMDA 05C-8.TE SMDA 12C-8.TE SMDA 15C-8.TE SMDA 24C-8.TE Wo r king Vo ltage 5V 12V 15V 24V Qty p e r Reel 2,500 2,500 2,500 2,500 R e e l Size 13 Inch 13 Inch 13 Inch 13 Inch Note: (1) No suffix indicates tube pack. Contact Information Semtech Corporation Protection Products Division 652 Mitchell Rd., Newbury Park, CA 91320 Phone: (805)498-2111 FAX (805)498-3804 a 2000 Semtech Corp. 7 www.semtech.com |
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